Product Construction:
| Backing material | Polyimide |
| Type of adhesive | silicone |
| Total thickness | 65 µm |
Properties:
| Temperature resistance | 260 °C |
| Elongation at break | 70 % |
| Tensile strength | 46 N/cm |
| Dielectric breakdown voltage | 6000 V |
| Insulation class | H |
Adhesion to Values:
| Adhesion to Steel | 2.8 N/cm |
Product Features:
- High temperature resistance (up to 260°C)
- Flame retardant according to UL510 and DIN EN 60454-2 (VDE 0340-2):2008-05, clause 20
- High chemical resistance and dielectric strength
- Residue-free removability for masking applications
Application Fields:
- tesa® 51408 is recommended for high temperature masking, e.g. powder coating, galvanizing
- The premium grade polyimide tape can be used for chemical production processes and wave soldering, e.g. during circuit board assembly
- Suitable for masking of 3D printing beds or electrical and thermal insulation, e.g. wire-or cable-wrapping
