Ultra-Thin Thermal Conductive Tape Solution – TESA 68549
In applications demanding extreme thinness, thermal conductivity, and environmental resistance—such as electronic assembly, thermal management, and micro-module bonding—traditional tapes often fail due to excessive thickness or poor conformability. TESA 68549 is an ultra-thin, transparent, double-sided tape with exceptional thermal conductivity, designed for precision electronics, offering a reliable solution for narrow-gap bonding and heat dissipation.
I. Core Product Positioning
TESA 68549 is a 20µm-thick transparent double-sided tape, featuring an ultra-thin PET backing + modified acrylic adhesive, suitable for:
- ✔ Microelectronic component bonding
- ✔ Mounting thermal pads/heat spreaders
- ✔ NFC antenna/sensor module attachment
- ✔ Ultra-thin gap filling & high-precision assembly
II. Technical Specifications Overview
| Parameter Category | Technical Specifications | Industry Significance |
|---|---|---|
| Backing Material | PET Film (Transparent, 2µm thick) | Ultra-thin, flexible, and stackable |
| Total Thickness | 20 µm | Minimizes space occupation in micro-assembly |
| Adhesive Type | Modified Acrylic | Ensures strong wetting & adhesion stability |
| Initial Tack | Low | Allows precise positioning & adjustments |
| Short-Term Temp. Resistance | 200°C | Withstands reflow soldering & hot-pressing |
| Long-Term Temp. Resistance | 100°C | Reliable performance over product lifespan |
| Resistance to Moisture/Chemicals/UV | Excellent | Stable in harsh environments |
| Static Shear Strength (23°C) | Medium | Secures lightweight components without slippage |
III. Four Key Advantages
Ultra-Thin & Precision Bonding
At just 20µm total thickness (2µm PET backing), TESA 68549 enables “invisible bonding” without affecting structural design, ideal for micro-gap filling.
Superior Thermal Conductivity
The ultra-thin structure + excellent wetting ensures full contact with surfaces, enhancing heat transfer efficiency for heat spreaders & IC modules.
High Environmental Resistance
Outstanding resistance to humidity, chemicals, and UV aging, ensuring stability in high-temperature, high-humidity, or outdoor conditions.
Flexible Conformability
Thin yet flexible PET backing adapts to curved surfaces, making it ideal for NFC antennas, flexible circuits, and MEMS modules.
IV. Typical Applications
- Electronic Module Assembly: Camera modules, fingerprint sensors
- Thermal Management: Heat spreader attachment for better cooling
- NFC/Antenna Bonding: Smartphones, wearables with tiny antennae
- Sensor Mounting: Precision attachment of flexible temp/pressure sensors
- Transparent Structures: High optical clarity for display/lighting
V. Technical Q&A
❓ Q: Does TESA 68549 provide thermal conductivity? Why “excellent heat transfer”?
→ Yes. Its ultra-thin structure + adhesive wetting ensures efficient heat dissipation, ideal for low-power thermal management.
❓ Q: Is the tape prone to tearing or weak adhesion due to thinness?
→ No. The PET backing is flexible yet durable, and the acrylic adhesive ensures strong, stable bonding.
❓ Q: Suitable for humid/outdoor environments?
→ Yes. It resists moisture, UV, and chemicals, performing reliably in demanding conditions.